Plasma-Preen System Advantages
Simplicity of construction
- Ease of Operation
- Time average uniformity
- Higher power densities.
- Large flat surfaces available and greater heights. (Up to 9 x 7" x 3" [228mm x 177mm x 75mm for standard systems, larger special systems available])
- Duty cycle control allows for high power and lower process temperatures.
- Analog power control
- Water cooling allows for higher reaction rates at higher plasma power and faster reaction rates.
- Uniform processing temperature that leads to uniform reaction rates as reaction rates are an exponential function of temperature difference across wafer surfaces.