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Applications
Wire Bond Pad Cleaning
ISSUE
The presence of contamination on the die pad causes the wire under the ultrasonic tool to slip and not generate the heat required to weld the wire to the die pad.
Cleaning Pd-Ag Die Attach Pads
Sputters away the oxygen of the silver oxide and removes surface organics
Cleaning Gold Plated Parts
Sputters away the oxygen of the gold oxide
Epoxy Bleed Removal
Epoxy bleed is caused during die attachment with epoxy adhesive. The epoxy components have different affinity for the ceramic substrate. Some of the components wet the substrate beyond the footprint of the die. This is referred to as epoxy bleed.
Sputters or oxidizes the epoxy bleed
Photoresist Removal
Photoresist removal and via descumming can be oxidized using an oxygen plasma.
Cleaning Ceramic Substrates
Sputters or oxidizes the organic contaminants
Cleaning Glass Parts
Cleaning Optics
Cleaning Semiconductor Surfaces
Removal of Plastic Encapsulants
for Failure Mode Analysis
Oxidizes the encapsulant, in conjunction with CF4 or SF6 removes SiO2 filler
Surface Preparation of Plastics for Gluing
Surface oxidation forming -OH and epoxy bonds.
Cleaning Silver Plated Parts
Reduction of Some Metal Oxides
Sputters away the oxygen
Removal of Oil or Epoxy Residues
Sputters or oxidizes the oil or epoxy