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Application

Applications

Wire Bond Pad Cleaning

ISSUE

The presence of contamination on the die pad causes the wire under the ultrasonic tool to slip and not generate the heat required to weld the wire to the die pad.

Cleaning Pd-Ag Die Attach Pads

Sputters away the oxygen of the silver oxide and removes surface organics

Cleaning Gold Plated Parts

Sputters away the oxygen of the gold oxide

Epoxy Bleed Removal

Epoxy bleed is caused during die attachment with epoxy adhesive. The epoxy components have different affinity for the ceramic substrate. Some of the components wet the substrate beyond the footprint of the die. This is referred to as epoxy bleed.

Sputters or oxidizes the epoxy bleed

Photoresist Removal

Photoresist removal and via descumming can be oxidized using an oxygen plasma.

Cleaning Ceramic Substrates

Sputters or oxidizes the organic contaminants

Cleaning Glass Parts

Sputters or oxidizes the organic contaminants

Cleaning Optics

Sputters or oxidizes the organic contaminants

Cleaning Semiconductor Surfaces

Sputters or oxidizes the organic contaminants

Removal of Plastic Encapsulants

for Failure Mode Analysis

Oxidizes the encapsulant, in conjunction with CF4 or SF6 removes SiO2 filler

Surface Preparation of Plastics for Gluing

Surface oxidation forming -OH and epoxy bonds.

Cleaning Silver Plated Parts

Sputters away the oxygen of the silver oxide and removes surface organics

Reduction of Some Metal Oxides

Sputters away the oxygen

Removal of Oil or Epoxy Residues

Sputters or oxidizes the oil or epoxy